SAMSUNG WILL SET UP CHIP PACKAGING RESEARCH FACILITY IN JAPAN

South Korea's Samsung Electronics (005930.KS) will invest around 40 billion yen ($280 million) over five years in a facility for research into advanced chip packaging it will set up in Japan, according to an announcement by the city of Yokohama. Samsung was looking at establishing a packaging facility in Kanagawa prefecture, where it already has a research and development centre, to deepen ties with Japanese makers of chipmaking equipment and materials.

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